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Automation and digital product integration provider
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Automation and digital product integration provider
LED Die Bonder
Background
The customer is an OEM with an LED die bonder used in the semiconductor industry. The machine in question is an automated device that transfers LED chips from wafer trays onto printed circuit boards (PCBs). The equipment carries out automatic die bonding of LED chips and includes sensors to detect any defects in the chips.
The Challenge
The LED die bonder operates at very rapid speeds and requires acute positioning accuracy for each chip. The OEM was looking for a motion control solution capable of meeting the high reliability, speed and precision requirements of the application, including operational efficiency of 90-100k units per hour, single action time of ≤70 m/s, and endpoint Positioning Accuracy of ≤6 μm.
The Benefits
FLEXEMATiC delivered a range of benefits to the customer, including improving the end-point positioning accuracy of the swing arm to 5.2 μm. The instruction takes 46 ms and the setting takes 11 ms, with a total time of 57 ms, without overshooting or jitters. Additionally, the solution delivers an efficiency improvement, achieving an efficiency of 45 K/H for single-side feeding and 90 K/H for double-side feeding. As well as enhancing equipment performance, FLEXEMATiC also provides cost advantages compared with competitors.
The Solution
The solution utilizes an industrial computer with motion control cards, paired with a 4 kW rotary hollow servo motor, along with FV5-U series rotary servo drives. The current for the DDL and voice coil motors ranges from 3 A to 6 A, complemented by FV5-U series direct-drive servo drives.
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LED Die Bonder
Phone: +1 959-263-9093
Email：info@flexematic.com
Add: 570 Hayden Station Rd, Unit D, Windsor, CT 06095
